Asia Advanced Materials —— Empowering Advanced Manufacturing
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10
2026-08
High‑elasticity copper alloys are indispensable in aerospace, electronics and telecommunications, precision instrumentation, and other fields. However, in conventional high‑end copper alloy systems, certain grades contain toxic elements, posing increasingly severe environmental and occupational health and safety challenges throughout production, processing, and recycling. Consequently, usage risks, supply‑chain uncertainties, and cost pressures continue to rise.
28
2026-05
CuCr25–50 Alloy Spherical Powder: Redefining Contact Fabrication
Copper–chromium (CuCr) contact materials exhibit excellent switching performance, superior arc‑erosion resistance, and low current‑limiting characteristics, making them widely used in vacuum circuit breakers and vacuum contactors rated at 126 kV and below. Among these properties, the uniformity of chromium distribution and the degree of grain refinement are critical determinants of the material’s core performance, directly influencing its electrical and thermal conductivity, service life, and dimensional stability. However, conventional powder metallurgy and casting processes have long been constrained by limitations in chromium particle size, resulting in coarse Cr phases, compositional segregation, and elevated oxygen and nitrogen contents. These issues significantly cap the performance ceiling of CuCr materials, posing substantial technical barriers to the production of high‑quality CuCr25–50 alloys.
16
2026-04
5.5%: The Path to Achieving Over 30% Room-Temperature Plasticity in CuCrNb-42 via SLM + HIP
CuCrNb-42, which combines high thermal conductivity with excellent high‑temperature strength, is a key heat‑dissipating material for the combustion chamber liners of next‑generation aerospace engines and can be fabricated via SLM followed by HIP, or directly by HIP. However, its drawback is also quite apparent: the material typically exhibits relatively low room‑temperature elongation.
25
2025-12
In the field of thermal management, pure copper has long been regarded as the gold standard for thermal conductivity. The theoretical thermal conductivity of oxygen-free pure copper is approximately 401 W/(m·K), a value that has for decades been considered virtually the upper limit of material performance at room temperature.
21
2025-11
Pure copper powder, with its excellent electrical and thermal conductivity and superior ductility, is a core material in high-end fields such as electronics, electrical engineering, and aerospace. Recently, Asia New Materials (Beijing) Co., Ltd. (hereinafter referred to as “Asia Materials”) has announced a major technological breakthrough: its independently developed pure copper powder, after rigorous testing, boasts an oxygen content as low as 60 ppm—far below industry standards. Coupled with a uniform particle size distribution, outstanding density, and exceptional flowability, it leads the industry with all‑round, cutting‑edge performance, injecting strong momentum into high‑end manufacturing.
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