Asia Advanced Materials —— Empowering Advanced Manufacturing
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Electrical and Electronic Engineering
Application Cases
Inductor coil
Plan
Equipment: SLM metal 3D printing equipment
Material: High-purity, low-oxygen ultrafine copper powder
Craftsmanship: The part is fabricated using selective laser melting (SLM), with ultrafine, low-oxygen copper powder produced by vacuum atomization, melted layer by layer. Post‑fabrication annealing is performed to further reduce the material’s oxygen content and enhance the electrical conductivity of the copper matrix, enabling the integrated formation of complex, hollow‑core coil structures.
Application areas
Core conductive components for on-board power inductors in new-energy vehicles and electromagnetic coils in energy-storage devices.
CPU cooler
Plan
Equipment: SLM metal 3D printing equipment
Material: High-purity, low-oxygen, ultra-fine spherical copper powder
Craftsmanship: Using selective laser melting (SLM) additive manufacturing, high-purity, low-oxygen, ultrafine copper powder produced by vacuum atomization is employed as the feedstock to 3D‑print complex microchannel heat‑dissipation structures in a single step. Post‑processing includes stress‑relief heat treatment to ensure both superior thermal conductivity and dense, defect‑free part integrity.
Application areas
Manufacturing of integrated cooling modules for high-end servers and high-performance computer CPUs.
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Consultation Phone Number
Email address
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Company Address
Room 509B, Floor 5, Building 30, Compound No. 26, Xihuan South Road, Beijing Economic-Technological Development Area
