2026 5th Additive Manufacturing Innovation Conference

July 15–17 | Hyatt Centric Ningbo Lakefront

The 5th Additive Manufacturing Innovation Conference (AMIC2026) will open with great fanfare from July 15 to 17 at the Hyatt Regency Ningbo Lakefront in Ningbo, Zhejiang. Bringing together academicians and leading experts, top-tier equipment manufacturers, materials‑R&D firms, and major aerospace integrators, the conference will host in-depth discussions on materials innovation, process breakthroughs, and the large‑scale deployment of high‑end additive manufacturing systems. It stands as one of the most influential industry‑wide forums for additive manufacturing in the Yangtze River Delta region in the second half of the year.

This conference features a dedicated forum on the new era of aerospace manufacturing. Our company has been invited to deliver a keynote presentation titled “Copper and Copper Alloy Powders: From High-Reflectivity, Refractory Materials to Aerospace‑Grade, Reliable Forming,” in which we will share our comprehensive technological achievements—spanning the overcoming of material‑related challenges to the validation of all‑dimensional performance at aerospace‑grade standards.

Industry Pain Points: From “Capable of Printing” to “Reliable Printing”

Copper and copper alloys, owing to their exceptionally high thermal and electrical conductivity, are essential materials for rocket thrust chambers, satellite thermal control cold plates, aerospace engine heat‑dissipation components, and airborne electronic microchannel heat exchangers. However, in selective laser melting (SLM) additive manufacturing, copper materials inherently face two major challenges:

Pain point one: Red laser has extremely low absorption rate.

The absorption rate of pure copper profiles for 1064 nm wavelength red laser light is only about 5%, while that of pure copper powder is approximately 20%; most of the energy is reflected, making melting and forming difficult.

Pain point 2: It is difficult to prepare copper alloy powders with a high-melting-point second phase.

A large number of alloying elements exhibit extremely low solubility in copper, making it difficult to produce Cu–Cr–Nb‑42‑based copper alloy powders in a stable, mass‑production manner.

II. Sharing of the Core Content from the Conference’s Keynote Reports

At this specialized forum, our company’s General Manager, Qin Yaxiya, will take the stage to deliver a comprehensive technical presentation, providing a thorough exposition of an integrated four‑dimensional solution encompassing powder materials, forming processes, heat treatment, and performance testing.

01 Copper and Copper Alloy Powder Systems

In response to the technical challenges posed by copper’s strong red-light reflectivity and its low solid solubility, Asia Materials has developed a diversified portfolio of copper and copper alloy powder products to meet the demands of various industries:

Pure copper : Conventional copper, high-conductivity copper, red‑light copper, ODS copper, high-purity copper, ultrafine copper, etc.;

High-strength, high-conductivity copper: CuCrZr, CuCrNb-42/84, CuNi2SiCr, QCr0.8, etc.;

Nickel silver: CuNi30;

Bronze: Cu15Ni8Sn, CuSn12Ni2, CuAINiFe, CuSn10, and others;

Brass: CuZn40, CuZn25, etc.;

Pseudo-alloy: CuCr, CuW, etc.;

02 Integrated Molding Process Plan for Copper Powder

A tailored, integrated process solution—encompassing dedicated powder storage, process control, hot isostatic pressing, and heat treatment—ensures the stable forming of commonly used aerospace copper alloys, including pure copper, CuCrZr, and CuCrNb series, with print‑part density consistently exceeding 99.9%.

03 A Full-Chain Aerospace‑Grade Performance Verification System

The report highlights a comprehensive set of authoritative validation data, fully addressing the assessment requirements for aerospace equipment:

Mechanical Properties: The elongation of pure copper exceeds 40%, that of CuCrNb‑42 surpasses 35%, and the hardness of Cu15Ni8Sn exceeds 35 HRC, among other achievements.

Physical Properties: The thermal conductivity of pure copper has exceeded 400 W/(m·K); the electrical conductivity in the as‑printed state has surpassed 101 IACS%.

04 Real-World Application Case: Ushering in a New Era of Aerospace Manufacturing

Drawing on real-world application cases, this analysis dissects the core advantages of additive manufacturing for copper alloys: rapid solidification microstructures, integrated part fabrication, streamlined process workflows, weight reduction and efficiency gains, enhanced cooling performance, and a substantial shortening of product development cycles—thereby supporting the independent upgrading of China’s high-end aerospace manufacturing capabilities.

With the grand event just around the corner, we look forward to welcoming you to Ningbo! We cordially invite industry partners across the entire value chain to join us at this conference, where we will gather to discuss the latest trends in additive manufacturing. On-site, we will showcase our proprietary technologies and deliver real‑world test results. We hope to exchange insights and explore collaborative opportunities with fellow professionals, working together to advance the industrialization of aerospace‑grade copper alloy materials. In‑person meetings for in‑depth dialogue are warmly welcomed.