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Product Introduction

Powder Introduction

Pure copper boasts excellent electrical and thermal conductivity, as well as superior ductility, making it an ideal material for applications such as wires and cables, electrical components, and heat exchangers. Powdered materials offer outstanding formability, meeting the requirements of various forming processes and underpinning an exceptionally broad industrial base.

Product System: Grade

Grade	Grade Description	Application scenarios	Product Features
AM-Cu	Regular spherical copper powder	SLM green-light forming SLM Red-Light Additive Manufacturing (1 kW) Powder metallurgy Electronics/Photovoltaic/Semiconductor Pastes Binder Jetting Injection Molding MIM Laser Cladding Cold spraying ……	General occasions
AM-Cu-HC	High Electrical & Thermal Conductivity		Demand for extreme thermal and electrical conductivity
AM-Cu-R01	Red laser-01	SLM Red-Light Additive Manufacturing (400 W)	1064 nm laser absorption rate: 40%
AM-Cu-ODS01	Oxide Dispersion Strengthened Copper 01	High-strength, high-conductivity pure copper	High-strength, high-conductivity pure copper
AM-Cu-HP	High Purity	High-purity application scenarios	Purity ≥ 4N/5N/6N

Product System: Particle Size

Granularity	Applied Technology	Application areas
1~5 μm	/	Electronics/Photovoltaic/Semiconductor Pastes
1~10 μm
1~15μm
0~25μm	MIM/BJ	Precision parts
15~38μm	SLM	Suitable for applications with stringent surface roughness requirements.
15~53 μm	SLM	Conventional SLM particle size range
45~106 μm	EBM	coil
53~150μm	DED/LC

Chemical composition	Cu	Bi	Sb	As	Fe	Pb	S	N	O
Chemical composition	≥99.95	≤0.002	≤0.003	≤0.003	≤0.005	≤0.006	≤0.005	≤0.02	≤0.05
Physical properties	Particle size distribution			Color difference value			Loose packing density (g/cm³)	Tap density (g/cm³)	Liquidity (s/50g)
	D10	D50	D90	L	a	b	4.68	5.71	13.5
	16.04	32.90	56.24	62.34	16.24	11.91	4.68	5.71	13.5

	Print typical mechanical properties				Print Typical Physical Properties
Status	Tensile strength UTS/MPa	Yield Strength YS/MPa	Elongation E/%	Percentage of reduction in area A/%	Density	Electrical conductivity IACS%	Thermal conductivity W/(m·K)
Print state	238	165	41.5%	50.0%	99.7%	99.5%	420
Heat-treated condition	230	165	37.0%	60.0%	/	100.1%	407

Pure copper powder

Category:

Pure copper

Brand: Asia Materials

Category: Pure Copper Powder

Product Name: Pure Copper Powder

European and American grade: Cu

Specifications and model numbers: 0–20 µm, 15–53 µm, 45–105 µm, 53–150 µm

Reference Standard: GB/T 5231-2022

Appearance: Nearly spherical

Oxygen content: ≤500 ppm

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For more product details, please contact our product experts. We look forward to your call.

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Product Introduction

Powder Introduction

Product System: Grade

Grade	Grade Description	Application scenarios	Product Features
AM-Cu	Regular spherical copper powder	SLM green-light forming SLM Red-Light Additive Manufacturing (1 kW) Powder metallurgy Electronics/Photovoltaic/Semiconductor Pastes Binder Jetting Injection Molding MIM Laser Cladding Cold spraying ……	General occasions
AM-Cu-HC	High Electrical & Thermal Conductivity		Demand for extreme thermal and electrical conductivity
AM-Cu-R01	Red laser-01	SLM Red-Light Additive Manufacturing (400 W)	1064 nm laser absorption rate: 40%
AM-Cu-ODS01	Oxide Dispersion Strengthened Copper 01	High-strength, high-conductivity pure copper	High-strength, high-conductivity pure copper
AM-Cu-HP	High Purity	High-purity application scenarios	Purity ≥ 4N/5N/6N

Product System: Particle Size

Granularity	Applied Technology	Application areas
1~5 μm	/	Electronics/Photovoltaic/Semiconductor Pastes
1~10 μm
1~15μm
0~25μm	MIM/BJ	Precision parts
15~38μm	SLM	Suitable for applications with stringent surface roughness requirements.
15~53 μm	SLM	Conventional SLM particle size range
45~106 μm	EBM	coil
53~150μm	DED/LC

Chemical composition	Cu	Bi	Sb	As	Fe	Pb	S	N	O
Chemical composition	≥99.95	≤0.002	≤0.003	≤0.003	≤0.005	≤0.006	≤0.005	≤0.02	≤0.05
Physical properties	Particle size distribution			Color difference value			Loose packing density (g/cm³)	Tap density (g/cm³)	Liquidity (s/50g)
	D10	D50	D90	L	a	b	4.68	5.71	13.5
	16.04	32.90	56.24	62.34	16.24	11.91	4.68	5.71	13.5

	Print typical mechanical properties				Print Typical Physical Properties
Status	Tensile strength UTS/MPa	Yield Strength YS/MPa	Elongation E/%	Percentage of reduction in area A/%	Density	Electrical conductivity IACS%	Thermal conductivity W/(m·K)
Print state	238	165	41.5%	50.0%	99.7%	99.5%	420
Heat-treated condition	230	165	37.0%	60.0%	/	100.1%	407

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