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Product Introduction
Powder Introduction
CuZn25 is the national‑standard H75 brass powder, a binary copper–zinc alloy containing 75% copper and 25% zinc. It is produced using your company’s vacuum electrode induction gas atomization or plasma ultrasonic atomization processes, resulting in powders with high sphericity, low oxygen and impurity levels, and excellent flowability.
It perfectly addresses the challenges of excessively high laser reflectivity and poor weldability in pure copper, offering a versatile copper-based powder that combines superior thermal and electrical conductivity, excellent ductility, a golden finish, and moderate corrosion resistance. It is compatible with SLM metal 3D printing, MIM metal injection molding, laser cladding, and powder metallurgy processes.
| Chemical composition |
Cu |
Zn |
Fe |
Pb |
Sn |
Yes |
P |
| 74.0~76.0 |
24.0~26.0 |
0.05 |
0.03 |
0.02 |
0.02 |
0.02 |
| Physical properties |
D10(μm) |
D50(μm) |
D90(μm) |
Loose packing density (g/cm³) |
Tap density (g/cm³) |
Flowability (s/50g) |
| 50.99 |
83.08 |
124.80 |
7.48 |
5.55 |
15.00 |
Application areas
1. Cultural and Creative Bronze Ornaments – Cultural Relics & Museums
• 3D-printed art ornaments, hollowed-out sculptures, museum‑grade replicas of ancient bronzes, scholar’s‑play accessories, and substitute components for gold, silver, and copper jewelry;
2. Electrical and electronic components, precision thermal management assemblies
• Integrated heat sinks for topology optimization of electronic products, micro‑array cooling structures for chips, RF conductive terminals, and connectors;
• A miniature water-cooling heat-dissipation channel for communication base stations, balancing electrical conductivity with high thermal conductivity, and non-magnetic to avoid interfering with electromagnetic signals.
CuZn25
Category:
Brand: Asia Materials
Category: Copper Alloy Powder
Product Name: CuZn25
European and American grades: /
Specification and model: 0–20 µm, 15–53 µm, 45–105 µm, 53–150 µm
Reference standard: /
Appearance: Nearly spherical
Oxygen content: ≤500 ppm
For more product details, please contact our product experts. We look forward to your call.
Product Introduction
Powder Introduction
CuZn25 is the national‑standard H75 brass powder, a binary copper–zinc alloy containing 75% copper and 25% zinc. It is produced using your company’s vacuum electrode induction gas atomization or plasma ultrasonic atomization processes, resulting in powders with high sphericity, low oxygen and impurity levels, and excellent flowability.
It perfectly addresses the challenges of excessively high laser reflectivity and poor weldability in pure copper, offering a versatile copper-based powder that combines superior thermal and electrical conductivity, excellent ductility, a golden finish, and moderate corrosion resistance. It is compatible with SLM metal 3D printing, MIM metal injection molding, laser cladding, and powder metallurgy processes.
| Chemical composition |
Cu |
Zn |
Fe |
Pb |
Sn |
Yes |
P |
| 74.0~76.0 |
24.0~26.0 |
0.05 |
0.03 |
0.02 |
0.02 |
0.02 |
| Physical properties |
D10(μm) |
D50(μm) |
D90(μm) |
Loose packing density (g/cm³) |
Tap density (g/cm³) |
Flowability (s/50g) |
| 50.99 |
83.08 |
124.80 |
7.48 |
5.55 |
15.00 |
Application areas
1. Cultural and Creative Bronze Ornaments – Cultural Relics & Museums
• 3D-printed art ornaments, hollowed-out sculptures, museum‑grade replicas of ancient bronzes, scholar’s‑play accessories, and substitute components for gold, silver, and copper jewelry;
2. Electrical and electronic components, precision thermal management assemblies
• Integrated heat sinks for topology optimization of electronic products, micro‑array cooling structures for chips, RF conductive terminals, and connectors;
• A miniature water-cooling heat-dissipation channel for communication base stations, balancing electrical conductivity with high thermal conductivity, and non-magnetic to avoid interfering with electromagnetic signals.
Product Inquiry
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